SMTS Packaging Engineer Job Listing at AMD in Hsinchu (Job ID 66429-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

Packaging Eng.  (PCB Development Eng)

THE ROLE:
Manage and drive PCB suppliers in the development and validation of high-performance PCB technologies to enable AMD product roadmap.

THE PERSON:
The ideal candidate should possess deep technical expertise in PCB design and fabrication processes. A strong hands-on background in high-speed, HLC+HDI PCB development is essential. This person should demonstrate the ability to work cross-functionally with electrical, mechanical, thermal, and manufacturing teams. Strong communication and problem-solving skills are required to drive design optimization and effective supplier collaboration.

KEY RESPONSIBILITIES:

• Drive PCB architecture and stack-up definition to meet electrical, thermal, and mechanical requirements
• Collaborate with designers to ensure signal integrity, power integrity, and EMI/EMC compliance
• Interface with PCB suppliers and contract manufacturing (CM) partners to manage DFM requirements
• Own PCB layout reviews, material selection, and fabrication process optimization
• Validate PCB performance through simulation, prototyping, and testing
• Support failure analysis and drive continuous improvement for yield and reliability throughout development and production phases

PREFERRED EXPERIENCE:

• 8+ years of experience in PCB design and development, preferably in data center GPU or high-performance computing applications
• Proven experience with via and trace impedance control and optimization
• Knowledge of industry standards (e.g., IPC-6012) and familiarity with regulatory compliance (e.g., RoHS, REACH)
• Familiarity with material properties and their impact on electrical performance
• Strong experience working with global suppliers and manufacturing partners
• Fluent in both spoken and written English.
• Experience in substrate development, from NPI to HVM, is a plus.

ACADEMIC CREDENTIALS:

• Required Degree: BS
• Preferred Degree: MS
• Preferred Major: Electronics Engineering, or related field

LOCATION:
Hsinchu, Taiwan

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.