Staff Packaging Engineer Job Listing at AMD in Singapore (Job ID 80228-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE:
You will lead NPI‑to‑HVM transitions and drive end‑to‑end DFM integration between the advanced package technology team and external manufacturing sites, ensuring manufacturable designs, stable ramp‑up, and high‑volume production readiness across a complex external manufacturing ecosystem.

You will own advanced package industrialization and high‑volume manufacturing readiness across Enterprise, Client, and AI accelerator product portfolios, with a particular focus on technologies such as CoWoS (2.5D interposer) and WLFO (fan‑out).

You will work with cross‑functional teams, including package design, substrate engineering, product engineering, reliability, test, quality, supply chain, and program management, to enabling stable, scalable manufacturing processes; orchestrate seamless NPI‑to‑HVM transfers; and drive yield, quality, and delivery performance across multiple external manufacturing sites.

THE PERSON:

This role combines strong advanced packaging process expertise with deep manufacturing and operations acumen, excelling at cross-functional integration and supplier enablement. Leveraging structured engineering methodologies such as DFM, DOE, SPC, FMEA, 8D, and Lean/Six Sigma. You will drive and ensure robust Processes of Record (POR), mitigate manufacturing risks, and accelerate ramp readiness for next-generation compute platforms—from enterprise server and client products to high-power AI accelerator systems.

KEY RESPONSIBILITIES:

NPI to HVM Industrialization

• Lead end-to-end industrialization of advanced package technologies from New Product Introduction (NPI) through High-Volume Manufacturing (HVM) readiness across external OSAT and foundry partners.
• Drive structured NPI-to-HVM processes, ensuring design, process, equipment, and quality readiness prior to volume ramp.
• Establish and maintain Process of Record (POR) for package assembly and test processes across multiple manufacturing sites.
• Coordinate ramp plans, risk mitigation strategies, and readiness reviews to ensure stable yield ramp and predictable manufacturing scale-up.

Design for Manufacturing (DFM) Integration

• Serve as the primary interface between package design, technology development, and external manufacturing partners to ensure manufacturable package architectures.
• Drive end-to-end DFM integration, identifying and resolving manufacturability gaps early in product development.
• Identify and close technology-to-manufacturing gaps to enable scalable deployment of next-generation packaging solutions.
• Contribute to continuous improvement of advanced package manufacturing methodologies and best practices across the supply chain.

External Supplier Manufacturing Management

• Partner with OSATs, foundries, and substrate suppliers to ensure manufacturing capability, capacity readiness, and process maturity for advanced packaging platforms.
• Monitor and drive yield, cycle time, quality, and delivery performance across external manufacturing sites.
• Lead supplier engagement on process optimization, defect reduction, and yield improvement initiatives.
• Conduct regular technical reviews, audits, and ramp readiness assessments with external manufacturing partners.

Yield, Quality, and Process Control

• Drive continuous improvement in manufacturing performance through DOE, SPC, FMEA, and data-driven root cause analysis.
• Lead cross-functional investigations for yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective actions (8D).
• Develop robust process monitoring frameworks and early detection mechanisms for advanced package assembly flows.
• Ensure alignment with corporate quality standards, reliability requirements, and product qualification criteria.

Cross-Functional Program Execution

• Collaborate with product development, package design, technology development, reliability engineering, product engineering, test engineering, supply chain, and program management to ensure aligned execution.
• Drive manufacturing readiness reviews, risk assessments, and ramp governance across multiple product lines.
• Support program teams in achieving cost, schedule, capacity, and production targets for Enterprise, Client, and AI accelerator products.

PREFERRED EXPERIENCE:

• Extensive years of experience in semiconductor packaging, assembly manufacturing, or product engineering, preferably in high-volume manufacturing environments.
• Proven experience driving New Product Introduction (NPI) and manufacturing ramp activities, including process qualification, manufacturing readiness, and yield ramp monitoring for advanced semiconductor packaging platforms.
• Experience working with internal manufacturing factories or external manufacturing partners, including OSATs, foundries, and substrate suppliers, supporting product ramp enablement, yield improvement, and manufacturing readiness.
• Demonstrated success driving yield improvement, defect reduction, and process optimization in high-volume manufacturing environments.
• Strong background in advanced packaging technologies, including 2.5D interposer architectures (e.g., CoWoS or similar), wafer-level fan-out (WLFO), and high-density flip-chip packages.
• Familiarity with front-end or wafer-level advanced packaging processes, including RDL (Redistribution Layer) and TCB (Thermo-Compression Bonding).
• Experience with panel-level packaging technologies or photonic integrated circuit (PIC) processing/packaging is considered a strong advantage.
• Solid understanding of Design for Manufacturing (DFM) principles and their application to semiconductor package design and assembly processes.
• Demonstrated experience in manufacturing problem solving and root cause analysis using structured methodologies such as DOE, SPC, FMEA, and 8D.
• Strong ability to analyze manufacturing data and drive yield, quality, and process improvements through data-driven decision making.
• Proven ability to work effectively in cross-functional environments, collaborating with package design, product engineering, reliability, quality, test, supply chain, and program management teams.
• Experience leading technical discussions and issue resolution with external manufacturing partners, including technical reviews and ramp readiness alignment.
• Excellent communication and stakeholder management skills, with the ability to translate complex engineering challenges into clear action plans across internal teams and suppliers.
• Fluent in English with strong written and verbal communication skills; proficiency in Mandarin is required to effectively collaborate with manufacturing partners within the regional supply chain ecosystem. Korean language capability is a plus.

ACADEMIC CREDENTIALS:

• Bachelor's or master's degree in mechanical engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline.

LOCATION:

Singapore

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD's “Responsible AI Policy” is available here.

This posting is for an existing vacancy.